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E+H Metrology GmbH
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MX302

MX302

E+H

The MX 302 measures a high resulution thickness scan. Prepared for integration into an automated etching system. Automatic measuring of wafers in the carrier.

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Application
規格

Measurement type
。Thickness

Wafer Diameter	150mm, 200mm
Thickness Accuracy	±0.5 µm
Resolution	0.1µm
Dynamic range	customized
Thickness range	up to 3
Software	EHMaster