冲成股份有限公司 JC's Chunson Limited
Wafer Edge Inspection

Wafer Edge Inspection

Hologenix

Hologenix 200mm and 300mm Automated Edge Defect Detection Automatically detect mid & large sized defects (diameter larger than 500um) such as Cracks, Chips, Scratches and Particles at the wafer edge. High-Resolution version automatically detects small defects (diameter larger than 30um). Images of the defects are automatically stored on the PC. KLARF reporting with defect images. Options: OCR, Bar Code Reader, Fan Filter Unit with HEPA-ULPA, and Host communication.