冲成股份有限公司 JC's Chunson Limited
MX 204-8-73-q

MX 204-8-73-q

E+H

The MX204-8-73-q works as manually loaded stand-alone tool as well as fully integrated in automated robot systems. With its 73 measuring points it controls thickness, bow and warp in high resolution. Different wafer sizes can be used without changeover thanks to the upstream centering station. Comes with our powerful MX-NT operating software.

Automatable geometry gauge for 182 and 210mm solar wafers.

Measurement type

。Thickness
。Flatness (TTV)
。Bow
。Warp
。Sori

Wafer Diameter 182mm, 210mm
Thickness Accuracy ±0.5 µm
Resolution 75nm
Thickness range 200 - 600 µm
Automatic wafer geometry gauge    yes
Software MXNT