E+H
Combined thickness and resistivity gauge for 200 mm and 300 mm silicon wafers.
Measurement type
。Thickness
。Flatness (TTV)
。Resistivity
。Sheet resistance
。P/N Dotation
Wafer Diameter | 200, 300 mm |
Thickness range | 600 – 900 μm |
Max. Warp | 100 μm |
Resistivity | 0.001 – 200 Ohm·cm |
Type check | 0.020 – 200 Ohm·cm |
Software | MXNT |