冲成股份有限公司 JC's Chunson Limited
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MX302

MX302

E+H

The MX 302 measures a high resulution thickness scan. Prepared for integration into an automated etching system. Automatic measuring of wafers in the carrier.
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Measurement type
。Thickness

Wafer Diameter 150mm, 200mm
Thickness Accuracy ±0.5 µm
Resolution  0.1µm
Dynamic range customized
Thickness range up to 3
Software EHMaster