冲成股份有限公司 JC's Chunson Limited
MX 3014

MX 3014

E+H

The MX3014 is a robust and stable instrument for quick and simple manual thickness gauge. Especially for thin wafers, unframed and framed with dicing tape or backgrind tape. Simple handling without the tape thickness nor the tape's dielectric constant. Light barriers avoid mismeasurement at the edges. Fully self-calibrating without the need for gauge blocks nor reference wafers. Integrated 5-digit display. Workes as stand-alone or connected to a PC via serial interface, which allows collecting data of multiple measurements, calculating flatness (TTV), mean value or standard deviati

Easy one-point thickness gauge for thin, framed 200mm and 300mm silicon wafers.

Measurement type
。Thickness

Wafer Diameter 200mm and 300mm
Thickness Accuracy ±0.5 µm
Resolution 0.5nm
Thickness range 0 - 1600µm
Software EHMaster