The MX204-8-21-TKO2 works as manually loaded stand-alone tool as well as fully integrated in automated robot systems. Especially for Taiko wafers, with or without protective tape. With its 21 measuring points it controls thickness, bow and warp after back side grinding. Throughput at least 80 wafers per hour. Different wafer sizes can be used without changeover thanks to the upstream centering station. Comes with our powerful MX-NT operating software.