MX 203-8-49-B
E+H
Fast contactless geometry gauge for thin 150mm and 200mm silicon wafers.
Measurement type
。Thickness
。Flatness (TTV)
。Bow
。Warp
| Wafer Diameter | 100mm, 200mm |
| Accuracy | ±0.6 µm |
| Resolution | 50nm |
| Thickness range | 150 - 650 µm |
| Automatic wafer | no |
| Software | MXNT |