E+H
Fast contactless geometry gauge for 75–200mm non-conductive and semi-insulating wafers.
Measurement type
。Thickness
。Flatness (TTV)
。Bow
。Warp
Wafer Diameter | 75mm - 150mm |
Accuracy | ±1 µm |
Resolution | 0.1µm |
Thickness range | 300 - 800 µm |
Non-conductive substrates | yes |
Semi-insluation materials | above 107 Ohm*cm |
Software | MXNT |