MX 203-4-21
E+H
Fast contactless geometry gauge for 2–4" silicon wafers.
Measurement type
。Thickness
。Flatness (TTV)
。Bow
。Warp
。Film stress
| Wafer Diameter | 50mm, 75mm, 100mm |
| Thickness Accuracy | ±5 µm |
| Resolution | 50nm |
| Thickness range | 200 - 800 µm |
| Automatic wafer | no |
| Software | MXNT |