冲成股份有限公司 JC's Chunson Limited
MX 3012-AC

MX 3012-AC

E+H

The MX301-AC is a robust and stable instrument for quick and simple manual thickness gauge. Made for a large variety of silicon and solar wafers and pieces of semiconducting or metallic materials. Fully self-calibrating without the need for gauge blocks nor reference wafers. With integrated 5-digit display. Workes as stand-alone or connected to a PC via serial interface, which allows collecting data of multiple measurements, calculating flatness (TTV), mean value or standard deviation of single wafers or of complete wafer lots.

Easy one-point thickness gauge for 75–300mm semiconducting and metallic materials.

Measurement type

。Thickness
。Flatness (TTV)

Wafer Diameter     75mm, 100mm, 150mm, 156mm, 200mm, 300mm
Accuracy ±0.5 µm+0.05%
Resolution   0.1µm
Thickness range     50 - 1600 µm
Automatic wafer geometry gauge No
Measuring time 0.3 s