冲成股份有限公司 JC's Chunson Limited
MX 1012

MX 1012

E+H

Easy adaption to different thickness ranges within a few seconds. Integration into automatic robotic sorter systems possible. The MX1012 is ideally suited for research & development, qualification of processes, and process control of thickness and flatness (TTV) especially after grinding and lapping. A pair of capacitive sensors samples four radial profiles (45 degrees) on every wafer which consist of hundreds of local thickness values. If necessary for your application, the four standard scans can be simply increased to reach an even higher measuring coverage. Comes with our p

High-resolution thickness and flatness (TTV) gauge for 200–300mm silicon wafers.

Measurement type
。Thickness 

。TTV

Wafer Diameter 200mm, 300mm
Accuracy ±0.1 µm
Resolution 10nm
Spartial resolution 1mm
Scans up to 8
Software MXNT